SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

In some embodiments, a semiconductor device includes a semiconductor chip including a first terminal, a second terminal and a third terminal, a frame electrically coupled to the second terminal, the frame mounting the semiconductor chip, a first conductor including a chip connection electrically cou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ARAI Masatoshi, NISHIWAKI Tatsuya, YOSHIOKA Chikako, TANAKA Bungo, KATOH Shunsuke, OZAWA Shinya, KAWANO Takahiro
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In some embodiments, a semiconductor device includes a semiconductor chip including a first terminal, a second terminal and a third terminal, a frame electrically coupled to the second terminal, the frame mounting the semiconductor chip, a first conductor including a chip connection electrically coupled to the first terminal, a first connection connecting to the chip connection and protruding from the chip connection, and a second connection connecting to the chip connection, protruding from the chip connection, and being provided physically spaced from the first connection. The semiconductor device further includes a second conductor electrically coupled to the third terminal.