SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A substrate processing apparatus includes a substrate support having a central first upper surface and a second upper surface surrounding the first upper surface and formed higher than the first upper surface, and an exhaust duct surrounding the substrate support, wherein a first through hole and a...

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Bibliographische Detailangaben
Hauptverfasser:	KATO Richika, HABA Kensuke
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A substrate processing apparatus includes a substrate support having a central first upper surface and a second upper surface surrounding the first upper surface and formed higher than the first upper surface, and an exhaust duct surrounding the substrate support, wherein a first through hole and a second through hole are formed in the substrate support, the first through hole being formed through the substrate support from the first upper surface, the second through hole connecting the first through hole and a side surface of the substrate support.