HEARING ASSISTANCE DEVICE INCORPORATING SYSTEM IN PACKAGE MODULE

A hearing assistance device comprises a system in package (SIP) disposed within an enclosure. The SIP module comprises a first substrate having a first surface and an opposing second surface, the first substrate supporting a first subsystem configured to perform a first function. A second substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lammi Kevin, Link Douglas F, Vang Ay, Mahon Shawn
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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