HEARING ASSISTANCE DEVICE INCORPORATING SYSTEM IN PACKAGE MODULE

A hearing assistance device comprises a system in package (SIP) disposed within an enclosure. The SIP module comprises a first substrate having a first surface and an opposing second surface, the first substrate supporting a first subsystem configured to perform a first function. A second substrate has a first surface and an opposing second surface, the second substrate supporting a second subsystem configured to perform a second function. The second surfaces face each other and at least one of the second surfaces supports one or more components. An interconnect layer is separate from and bonded to and between the first and second substrates. The interconnect layer comprises a window and a region peripheral to the window. The window is sized to accommodate the one or more components and the peripheral region comprising electrical pathways for electrically connecting the first subsystem and the second subsystem.