METHODS OF MAKING PRESSURE SENSITIVE ADHESIVE COMPOSITIONS

METHODS OF MAKING PRESSURE SENSITIVE ADHESIVE COMPOSITIONS

Disclosed is a method comprising: a) dispersing a first monomer mixture comprising least one least monomer, the first monomer mixture having a total glass transition temperature (Tg) in the range of from −10° C. to −65° C. with a surfactant and an initiator in an aqueous medium; b) when the first mo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Patrick Steven R, Griffith, JR. William B, Nedwick Paul, Einsla Melinda L
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:Disclosed is a method comprising: a) dispersing a first monomer mixture comprising least one least monomer, the first monomer mixture having a total glass transition temperature (Tg) in the range of from −10° C. to −65° C. with a surfactant and an initiator in an aqueous medium; b) when the first monomer mixture is completely dispersed, adding a second monomer mixture comprising at least one monomer, the second monomer mixture having a Tg at least 20° C. greater than the Tg of the first monomer mixture, to the aqueous medium; c) when the second monomer mixture is completely dispersed, adding a third monomer mixture comprising at least one monomer, the third monomer mixture having a Tg in the range of from −25° C. to 50° C.; and d) forming a polymer with the first, second, and third monomer mixtures. Also disclosed is a pressure sensitive adhesive comprising the polymer formed by this method.