Optoelectronic Assembly, and Method for Producing an Optoelectronic Assembly

An optoelectronic assembly (10) is provided in different embodiments. The optoelectronic assembly (10) has the following; a printed circuit board (12); at least one optoelectronic first component (20) which is arranged on a first face (14) of the printed circuit board (12); a heat sink (24) which ha...

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Bibliographische Detailangaben
1. Verfasser:	Rosenbauer Georg
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An optoelectronic assembly (10) is provided in different embodiments. The optoelectronic assembly (10) has the following; a printed circuit board (12); at least one optoelectronic first component (20) which is arranged on a first face (14) of the printed circuit board (12); a heat sink (24) which has a first surface (26) that is arranged on a second printed circuit board (12) face (16) facing away from the first component (20), wherein a boundary surface (34) extends between the second face (16) and the first surface (26); and at least one first welding connection (30), by means of which the heat sink (24) is directly connected to the printed circuit board (12) in a bonded manner and which together with the boundary surface (34) forms a first cut surface (36), the first component (20) at least partly overlapping the cut surface.