CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF

CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF

Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can...

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Bibliographische Detailangaben
Hauptverfasser: Gelorme Jeffrey Donald, Gaynes Michael Anthony, Chainer Timothy Joseph, Colgan Evan George, Parida Pritish Ranjan, Schultz Mark Delorman, Webb Bucknell C, Brunschwiler Thomas J, Ozsun Ozgur, McVicker Gerard
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.