COEFFICIENT OF THERMAL EXPANSION (CTE) MATCHED TRANSISTOR OUTLINE (TO) HEADER

COEFFICIENT OF THERMAL EXPANSION (CTE) MATCHED TRANSISTOR OUTLINE (TO) HEADER

A transistor outline (TO) package may include a TO cap. The TO package may include a TO header. The TO header may include a header stem of a first material and a first coefficient of thermal expansion (CTE) value. The TO header may include a header base of a second material and a second CTE value. T...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUERIN Nicolas, WANG Lihua, GUO Yonghong, XU Jack, DING Yaogeng
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Beschreibung
Zusammenfassung:A transistor outline (TO) package may include a TO cap. The TO package may include a TO header. The TO header may include a header stem of a first material and a first coefficient of thermal expansion (CTE) value. The TO header may include a header base of a second material and a second CTE value. The first material and the second material may be different. The first CTE value and the second CTE value may be different. The first CTE value and the second CTE value may be within a threshold percentage of each other.