PACKAGE FOR DIE-BRIDGE CAPACITOR

In some examples, a device comprises a first leadframe segment, a second leadframe segment, and a first transistor, wherein the first transistor is electrically connected to the first leadframe segment. The device further comprises a second transistor, wherein the second transistor is electrically c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Galipeau Darryl, Cho Eung San, Clavette Danny
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In some examples, a device comprises a first leadframe segment, a second leadframe segment, and a first transistor, wherein the first transistor is electrically connected to the first leadframe segment. The device further comprises a second transistor, wherein the second transistor is electrically connected to the second leadframe segment. The device further comprises a conductive element, wherein the conductive element is electrically connected to the first transistor and the second transistor. The device further comprises a capacitor, wherein a first end of the capacitor is electrically connected to the first leadframe segment and a second end of the capacitor is electrically connected to the second leadframe segment.