SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a firs...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE Sul, KIM Heehwan
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.