ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTION COMPONENT

ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTION COMPONENT

Disclosed herein is an electrically conductive material including a base material made of a copper alloy sheet strip, a Cu-Sn alloy coating layer and a reflow Sn coating layer, wherein the Cu-Sn alloy coating layer and the reflow Sn coating layer are arranged on a surface of the base material in thi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NOMURA Koya
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CURRENT COLLECTORS
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
LINE CONNECTORS
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Disclosed herein is an electrically conductive material including a base material made of a copper alloy sheet strip, a Cu-Sn alloy coating layer and a reflow Sn coating layer, wherein the Cu-Sn alloy coating layer and the reflow Sn coating layer are arranged on a surface of the base material in this order from a side of the base material, parts of the Cu-Sn alloy coating layer are exposed on a surface, a coefficient of friction in each of a direction perpendicular to and a direction inclined by 45° to a rolling direction of the copper alloy base material is reduced, compared to that in the rolling direction of the copper alloy base material.