METHOD AND APPARATUS FOR BENDING DECOUPLED ELECTRONICS PACKAGING

An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MUELLER Tim, HAUBOLD Carsten, TREVIRANUS Joachim, PETER Andreas
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enclosure that does not mechanically overload the electronics module. In some embodiments, the joint may be a ball joint.