TEST APPARATUS WHICH TESTS SEMICONDUCTOR CHIPS

A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and...

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1. Verfasser: JANG UNG JIN
Format: Patent
Sprache:eng
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Zusammenfassung:A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.