REARWARD ACOUSTIC DIFFUSION FOR ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY

A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.

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Hauptverfasser: McNulty Christopher Thomas, Hageman Matthew R
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creator McNulty Christopher Thomas
Hageman Matthew R
description A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.
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subjects DEAF-AID SETS
DIAGNOSIS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
ELECTROTHERAPY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
MAGNETOTHERAPY
MEDICAL OR VETERINARY SCIENCE
PUBLIC ADDRESS SYSTEMS
RADIATION THERAPY
SURGERY
ULTRASOUND THERAPY
title REARWARD ACOUSTIC DIFFUSION FOR ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY
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