REARWARD ACOUSTIC DIFFUSION FOR ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY

A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.

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Bibliographische Detailangaben
Hauptverfasser:	McNulty Christopher Thomas, Hageman Matthew R
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS DIAGNOSIS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY ELECTROTHERAPY HUMAN NECESSITIES HYGIENE IDENTIFICATION LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MAGNETOTHERAPY MEDICAL OR VETERINARY SCIENCE PUBLIC ADDRESS SYSTEMS RADIATION THERAPY SURGERY ULTRASOUND THERAPY
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Beschreibung
Zusammenfassung:	A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.