Sensor Module And Method For Producing A Sensor Module

A sensor module contains a sensor unit, a sensor cover, and a main body. The sensor unit has a sensor surface and a base surface. The sensor cover covers the sensor surface and at least a section of the base surface. The sensor cover is connected to the base surface and/or the main body by a fused c...

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Bibliographische Detailangaben
Hauptverfasser:	KEUTEN MATTHIAS, HENNIGER JUERGEN, WIECZOREK MATTHIAS
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TARIFF METERING APPARATUS TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A sensor module contains a sensor unit, a sensor cover, and a main body. The sensor unit has a sensor surface and a base surface. The sensor cover covers the sensor surface and at least a section of the base surface. The sensor cover is connected to the base surface and/or the main body by a fused connection. The main body is connected at least to the base surface of the sensor unit by a fused connection with a selectable relative position in relation to the sensor cover. Pre-mounting of the sensor unit in a sensor cover and advantageous encapsulation of a sensor can thus be achieved.