CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a...

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Bibliographische Detailangaben
Hauptverfasser:	Vergis George, Viswanath Ram S, Holden Thomas T, Swaminathan Rajasekaran, Lynch John M, Llapitan David J, Coury Bassam N, Ziakas Dimitrios, Murtagian Gregorio R, Zhang Zhichao, Liu Kuang C, Zhao Chong J, Li Xiang, Smalley Jeffory L, Thibado Jonathan W, Ganesan Sanka, Prakash Mani
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.