LED PACKAGE WITH INTEGRATED FEAUTRES FOR GAS OR LIQUID COOLING

LED PACKAGE WITH INTEGRATED FEAUTRES FOR GAS OR LIQUID COOLING

A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Golubovic Dusan, Mehnert Axel, Eggink Hendrik Jan, Donker Marcus Franciscus, Treurniet Theodoor Cornelis, Van Honschooten Rene
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.