CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.

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Bibliographische Detailangaben
Hauptverfasser:	SONG Sang Hyeon, KIM Byoung Yong, HWANG Jeong Ho
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.