COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT CHIPS

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT CHIPS

An integrated circuit (IC) chip includes a copper structure with an intermetallic coating on the surface. The IC chip includes a substrate with an integrated circuit. A metal pad electrically connects to the integrated circuit. The copper structure electrically connects to the metal pad. A solder bu...

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Bibliographische Detailangaben
1. Verfasser: JIANG Hunt Hang
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit (IC) chip includes a copper structure with an intermetallic coating on the surface. The IC chip includes a substrate with an integrated circuit. A metal pad electrically connects to the integrated circuit. The copper structure electrically connects to the metal pad. A solder bump is disposed on the copper structure. The surface of the copper structure has a coating of intermetallic. The copper structure can be a redistribution layer and a copper pillar that is disposed on the redistribution layer.