POLYMER COMPOUND, SURFACE TREATMENT AGENT, LAMINATED BODY USING SURFACE TREATMENT AGENT, TRANSISTOR, METHOD FOR MANUFACTURING LAMINATED BODY

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents...

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Bibliographische Detailangaben
Hauptverfasser: KAWAKAMI Yusuke, Koizumi Shohei, Sugizaki Takashi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]