SEMICONDUCTOR DEVICE

A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIYAKOSHI Takeshi, MATSUBARA Hiroaki, SAKUMOTO Shotaro, NAKAMURA Shingo, CHIKAI Tomoshige, HOSOYAMADA Sumikazu, KUMAGAYA Yoshikazu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.