POLISHING PAD-MEASURING APPARATUS AND CHEMICAL MECHANICAL POLISHING FACILITY USING THE SAME

Example embodiments of the inventive concepts provide a polishing pad-measuring apparatus and a chemical mechanical polishing facility using the same. The polishing pad-measuring apparatus includes a foreign material-removing part for removing a foreign material disposed in grooves extending from on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Shin Ki-Roo, Kim Kwangchun, Han Sangkyeong, Cho Junghun, LEE Kwangsung, Lim Yeonjun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Example embodiments of the inventive concepts provide a polishing pad-measuring apparatus and a chemical mechanical polishing facility using the same. The polishing pad-measuring apparatus includes a foreign material-removing part for removing a foreign material disposed in grooves extending from one surface of a polishing pad toward another surface, opposite to the one surface, of the polishing pad, and a distance measuring part for measuring depths of the grooves from which the foreign material is removed.