COOLING DEVICE FOR HOT-DIP PLATED STEEL SHEET

The present invention provides a cooling device for a hot-dip plating device provided on an upper side of a plating thickness control device in a conveyance route of a hot-dip plated steel sheet that is conveyed from a plating bath in a vertically upward direction. The cooling device includes: a mai...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HAYAKAWA Kohhei, OOHASHI Tooru, MACHIDA Kazuki, KOJIMA Katsuya, NAKATA Hiroshi
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention provides a cooling device for a hot-dip plating device provided on an upper side of a plating thickness control device in a conveyance route of a hot-dip plated steel sheet that is conveyed from a plating bath in a vertically upward direction. The cooling device includes: a main cooling device that vertically sprays a main cooling gas to the hot-dip plated steel sheet; and a preliminary cooling device that is provided in a preliminary cooling section between the main cooling device and the plating thickness control device in the conveyance route, and sprays a preliminary cooling gas to a plurality of gas collision positions which are set along the preliminary cooling section.