SEMICONDUCTOR DEVICES

A semiconductor device includes a semiconductor substrate including a first source/drain region formed in an upper portion of the semiconductor substrate, a metal silicide layer that covers a top surface of the first source/drain region, and a semiconductor pillar that penetrates the metal silicide...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Heo YeonCheol, Cantoro Mirco
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor device includes a semiconductor substrate including a first source/drain region formed in an upper portion of the semiconductor substrate, a metal silicide layer that covers a top surface of the first source/drain region, and a semiconductor pillar that penetrates the metal silicide layer and is connected to the semiconductor substrate. The semiconductor pillar includes a second source/drain region formed in an upper portion of the semiconductor pillar, a gate electrode on the metal silicide layer, with the gate electrode surrounding the semiconductor pillar in a plan view. A contact is connected to the metal silicide layer.