STRUCTURE OF CHIP ON SOFT PANEL AND LIQUID CRYSTAL DISPLAY PANEL EQUIPPED WITH CHIP ON SOFT PANEL

The invention discloses a structure of a chip on a soft panel, including a soft panel whereon a set of lead wires on an input terminal and a set of lead wires on an output terminal deposited, a bonding region formed on each end of the lead wires on the output terminal; a driver chip, which is deposi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GUO Dongsheng, SONG Haiman
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	The invention discloses a structure of a chip on a soft panel, including a soft panel whereon a set of lead wires on an input terminal and a set of lead wires on an output terminal deposited, a bonding region formed on each end of the lead wires on the output terminal; a driver chip, which is deposited on the soft panel and connected to the lead wires on the input terminal and that on the output terminal electrically; a connection of the bonding region and an end of the corresponding lead wire is defined as A, and where the bonding region apart from the end of the corresponding lead wire on the output terminal is defined as B, a distance between A and B is L, an area of the bonding region is larger than that of the corresponding lead wire on the output terminal in the distance L.