APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES

An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment asse...

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Bibliographische Detailangaben
Hauptverfasser:	HILL Bridget, PLISKA Milan, HAMMER Dietmar, BRUGGER Michael, SCHWARZENBACHER Reinhold
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment assembly is mounted above the upper surface of the spin chuck and underlying a wafer-shaped article when mounted on the spin chuck. The treatment assembly extends parallel to the upper surface from an axis of rotation of the spin chuck radially to a distance that is at least half the predetermined diameter. The spin chuck comprises upwardly projecting gripping pins configured to hold a wafer-shaped article in position, wherein the gripping pins do not pass through the treatment assembly.