METHOD AND APPARATUS TO DETERMINE A PATTERNING PROCESS PARAMETER

A metrology target includes: a first structure arranged to be created by a first patterning process; and a second structure arranged to be created by a second patterning process, wherein the first structure and/or second structure is not used to create a functional aspect of a device pattern, and wh...

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Bibliographische Detailangaben
Hauptverfasser: HINNEN Paul Christiaan, TSIATMAS Anagnostis, WANG Shu-jin, ZAAL Martijn Maria, McNAMARA Elliott Gerard, VERMA Alok, VAN LEEST Adriaan Johan, VAN WITTEVEEN Koen, THEEUWES Thomas, CRAMER Hugo Augustinus Joseph, DE LA FUENTE VALENTIN Maria Isabel
Format: Patent
Sprache:eng
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Zusammenfassung:A metrology target includes: a first structure arranged to be created by a first patterning process; and a second structure arranged to be created by a second patterning process, wherein the first structure and/or second structure is not used to create a functional aspect of a device pattern, and wherein the first and second structures together form one or more instances of a unit cell, the unit cell having geometric symmetry at a nominal physical configuration and wherein the unit cell has a feature that causes, at a different physical configuration than the nominal physical configuration due to a relative shift in pattern placement in the first patterning process, the second patterning process and/or another patterning process, an asymmetry in the unit cell.