INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.

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Bibliographische Detailangaben
1. Verfasser: Kwark Young Hoon
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.