EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL AND FIBER-REINFORCED MOLDED ARTICLE

To provide: an epoxy resin composition which has excellently low thermal expansion, excellently low moisture absorption and high heat resistance, and which provides a cured product that is small in volume change after thermal history; a curable resin composition; a cured product that has all of the...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA Takamitsu, HIROTA Yousuke, SATOU Yutaka
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	To provide: an epoxy resin composition which has excellently low thermal expansion, excellently low moisture absorption and high heat resistance, and which provides a cured product that is small in volume change after thermal history; a curable resin composition; a cured product that has all of the above-described properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is an epoxy resin which is characterized by containing, as essential components, (A) a cresol-naphthol co-condensed novolac epoxy resin, (B) a glycidyl ether compound of naphthol, and (C) one or more xanthene compounds selected from the group consisting of compounds represented by one of formulae (1)-(3), and which is also characterized in that the content ratio of the xanthene compounds (C) as determined by GPC measurement is 0.1-5.5% in terms of area ratio.