GLASS LAMINATE, METHOD FOR PRODUCING SAME AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

To provide a glass laminate of which an increase of the peel strength between a glass substrate and a silicone resin layer is suppressed even after a high temperature heat treatment, and from which the glass substrate can readily be separated. A glass laminate comprising a support substrate, a silic...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MIYAGOE Tatsuzo, YAOITA Takatoshi, MIYAZAWA Hideaki
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a glass laminate of which an increase of the peel strength between a glass substrate and a silicone resin layer is suppressed even after a high temperature heat treatment, and from which the glass substrate can readily be separated. A glass laminate comprising a support substrate, a silicone resin layer and a glass substrate in this order, with a peel strength at the interface between the support substrate and the silicon resin layer higher than the peel strength at the interface between the silicone resin layer and the glass substrate, wherein a silicone resin in the silicone resin layer is a cured product obtained by reacting an alkenyl-group containing organopolysiloxane (A) and a hydrogen polysiloxane (B) having a hydrosilyl group, and the mixing molar ratio of the hydrosilyl groups in the hydrogen polysiloxane (B) to the alkenyl groups in the alkenyl group-containing organopolysiloxane (A) (that is, number of mols of hydrosilyl groups/number of mols of alkenyl groups) is from 0.15/1 to 0.65/1.