GRINDING TOOL

A polishing apparatus includes: a holding section that holds a material to be polished; a polishing body that polishes the material to be polished held by the holding section; a head that supports the polishing body via an elastic mechanism; a driving mechanism that causes the head to be moved in a...

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Bibliographische Detailangaben
Hauptverfasser:	TOMIYASU MASATERU, MUROFUSHI YU, OMAGARI HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing apparatus includes: a holding section that holds a material to be polished; a polishing body that polishes the material to be polished held by the holding section; a head that supports the polishing body via an elastic mechanism; a driving mechanism that causes the head to be moved in a Z coordinate direction; a control unit that controls the driving mechanism; and a position sensor that measures a position of the polishing body with respect to the head. The load control is performed based on a measurement value of the position sensor and a spring constant value of the elastic mechanism.