ANISOTROPIC CONDUCTIVE FILM, CONNECTION METHOD, AND JOINED BODY

An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component...

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Bibliographische Detailangaben
Hauptverfasser: Sekiguchi Morio, Kumakura Susumu, Yamada Yasunobu
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10° C. to 250° C. and a heating speed is 10° C./min, and wherein T2 is 30° C. or higher, and T4−T2 is greater than 0° C. but 80° C. or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.