REDUCED ELECTRICAL TERMINATIONS IN SURFACE-MOUNT TECHNOLOGY COMPONENTS

Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: De La Cruz Giancarlo F, Chen Wyeman, Morrison Scott D, Chen Lin, Mead Curtis C, Wang Albert, Vo Vu, Simeral Brad W, Martinez Paul A
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.