Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna

To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on...

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Bibliographische Detailangaben
1. Verfasser:	Fukuchi Ryo
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 μm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200° C. for 30 minutes or after heating at 130° C. for 30 minutes or after heating at 300° C. for 30 minutes.