METHOD FOR BONDING SUBSTRATES TO COLD AND DAMP SURFACES

A description is given of a method, and of pressure-sensitive adhesive compositions suitable therefor, for bonding a substrate to cold and damp surfaces, the surface temperature being lower than the dewpoint temperature of the air in contact with the surface, and the pressure-sensitive adhesive comp...

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Bibliographische Detailangaben
1. Verfasser:	DIMMER Joerg-Alexander
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A description is given of a method, and of pressure-sensitive adhesive compositions suitable therefor, for bonding a substrate to cold and damp surfaces, the surface temperature being lower than the dewpoint temperature of the air in contact with the surface, and the pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive polymer formed from defined amounts of 2-ethylhexyl acrylate, monomers selected from C1 to C2 alkyl (meth)acrylates, styrene, acid monomers, and optionally further monomers, in the presence of chain transfer agents.