HERMETIC SEALING METHOD AND HERMETIC-SEALED SUBSTRATE PACKAGE

HERMETIC SEALING METHOD AND HERMETIC-SEALED SUBSTRATE PACKAGE

The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the pres...

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Hauptverfasser: Yang Choon Bong, Kim Bo Mi, Kim Jhee Mann, Lee Ki Yeon, Oh Yoon Seuk
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
GLASS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
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creator Yang Choon Bong
Kim Bo Mi
Kim Jhee Mann
Lee Ki Yeon
Oh Yoon Seuk
description The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the present invention provides a hermetic sealing method comprising: a substrate preparation step for preparing a first substrate and a second substrate smaller than the first substrate; a glass frit paste applying step for applying the glass frit paste such that the glass frit paste adheres to the upper periphery of the first substrate and a side of the second substrate while the first and second substrates are disposed to face each other; and a laser irradiation step for irradiating a laser beam to the applied glass frit paste to hermetically seal the space between the first and second substrates.
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subjects CHEMISTRY
GLASS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
title HERMETIC SEALING METHOD AND HERMETIC-SEALED SUBSTRATE PACKAGE
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