HERMETIC SEALING METHOD AND HERMETIC-SEALED SUBSTRATE PACKAGE

The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the pres...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Yang Choon Bong, Kim Bo Mi, Kim Jhee Mann, Lee Ki Yeon, Oh Yoon Seuk
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL
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Beschreibung
Zusammenfassung:	The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the present invention provides a hermetic sealing method comprising: a substrate preparation step for preparing a first substrate and a second substrate smaller than the first substrate; a glass frit paste applying step for applying the glass frit paste such that the glass frit paste adheres to the upper periphery of the first substrate and a side of the second substrate while the first and second substrates are disposed to face each other; and a laser irradiation step for irradiating a laser beam to the applied glass frit paste to hermetically seal the space between the first and second substrates.