MULTILAYER CIRCUIT STRUCTURE

An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The r...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Huang Meng-Chi, Kao Tune-Hune
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.