PROGRAM AND DEVICE FOR SUPPRESSING TEMPERATURE RISE OF MEMORY

A memory having stacked memory modules in which heat generated during memory read/write operations can be effectively dissipated, thus avoiding an undesirable localized temperature rise. The storage device is provided with a plurality of stacked memory modules. When a data write request is received, a data processing device that fulfills the role of a memory controller sequentially selects a memory module that is to be a write destination in such a manner that memory modules to which data is written simultaneously are not adjacent to each other, and in a series of write sequences, the memory module to which data is to be written at a subsequent write timing is not adjacent to the memory module to which data is written at a preceding write timing. As a result, the locations of heat generation among the plurality of stacked memory modules are distributed, reducing a rise in temperature.