ULTRASOUND TRANSDUCER ARRAY WITH SEPARATED ACOUSTIC AND ELECTRIC MODULE

Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.