WIRED CIRCUIT BOARD

The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or les...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANABE Hiroyuki, SUGIMOTO Yuu
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.