ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE

The present invention relates to an adhesive film for a semiconductor chip with a through electrode, to be used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, the adhesive film having a minimum melt viscosity of 50 to 2500 Pa·s and a thixotropic ind...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAKEDA Kohei, NAGATA Mai, ENAMI Toshio
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS THEREOF DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL NON-METALLIC ELEMENTS PAINTS POLISHES PREPARATION OF CARBON BLACK SEMICONDUCTOR DEVICES TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to an adhesive film for a semiconductor chip with a through electrode, to be used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, the adhesive film having a minimum melt viscosity of 50 to 2500 Pa·s and a thixotropic index at 140° C. of 8 or lower.