MOISTURE CURABLE SILICONE COMPOSITION
The present invention provides curable compositions comprising (A) an polymer having a reactive silicon-containing group, (B) a cross-linker and/or a chain extender, (C) a non-tin metal catalyst, (D) an adhesion promoter, (E) optionally a filler, (F) optionally cure accelerator. The above curable co...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention provides curable compositions comprising (A) an polymer having a reactive silicon-containing group, (B) a cross-linker and/or a chain extender, (C) a non-tin metal catalyst, (D) an adhesion promoter, (E) optionally a filler, (F) optionally cure accelerator. The above curable compositions exhibit excellent adhesiveness, deep section cure, stable curability even after storage and/or retained physical properties even after subjecting to the accelerated humidity and temperatures. |
---|