CHIP CARRIER HAVING VARIABLY-SIZED PADS

Chip carriers having variably-sized solder pads, and integrated circuit packages incorporating such chip carriers are described. In an example, an integrated circuit package includes an integrated circuit electrically connected with a chip carrier having solder pads of different sizes. The integrate...

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Bibliographische Detailangaben
Hauptverfasser:	WEI CHUNG Lee, LAM Chun Mun, LOKE Mun Leong, WONG Chee Ling, ONG Kang Eu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Chip carriers having variably-sized solder pads, and integrated circuit packages incorporating such chip carriers are described. In an example, an integrated circuit package includes an integrated circuit electrically connected with a chip carrier having solder pads of different sizes. The integrated circuit may deliver high speed signals to smaller solder pads and low speed signals to larger solder pads. More particularly, the solder pads having smaller pad dimensions may better match impedance of a high speed signal line as compared to the solder pads having larger pad dimensions.