ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

An electronic device includes a conductive layer, a device die, and a connecting member. The conductive layer is formed by coating a conductive material on a substrate. The device die and the connecting member are disposed on the conductive layer and spaced from each other. The device die includes a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: UMALI Pompeo V, YEUNG SHUN TIK, LAM Kan Wae, LEUNG Chi Ho, CHAU On Lok
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device includes a conductive layer, a device die, and a connecting member. The conductive layer is formed by coating a conductive material on a substrate. The device die and the connecting member are disposed on the conductive layer and spaced from each other. The device die includes a first connection point on one side that is in contact with and electrically connected to the conductive layer, and a second connection point on another side thereof. The connecting member includes a third connection point on a side thereof electrically connected to and in contact with the conductive layer, and a fourth connection point on another side thereof. The second and fourth connection points are configured to provide external connections of the electronic device.