SILICON BIPOROUS WICK FOR HIGH HEAT FLUX HEAT SPREADERS
A wicking structure comprising a biporous wick formed with a semiconductor (e.g., silicon), wherein the biporous wick comprises first pores and second pores formed by the semiconductor and the first pores are larger than the second pores.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A wicking structure comprising a biporous wick formed with a semiconductor (e.g., silicon), wherein the biporous wick comprises first pores and second pores formed by the semiconductor and the first pores are larger than the second pores. |
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