SILICON BIPOROUS WICK FOR HIGH HEAT FLUX HEAT SPREADERS

A wicking structure comprising a biporous wick formed with a semiconductor (e.g., silicon), wherein the biporous wick comprises first pores and second pores formed by the semiconductor and the first pores are larger than the second pores.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Reilly Sean W, Sunada Eric T, Yee Karl Y
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A wicking structure comprising a biporous wick formed with a semiconductor (e.g., silicon), wherein the biporous wick comprises first pores and second pores formed by the semiconductor and the first pores are larger than the second pores.