COOLING MODULE AND ELECTRONIC DEVICE

The cooling module includes a heat sink for cooling a power component of an ultrasonic source and a resonance tube arranged between the ultrasonic source and the heat sink. The cooling module is designed to guide a stream of air flowing through the resonance tube in a circumferential predefined dire...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Löschke Jakob, Mock Randolf
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The cooling module includes a heat sink for cooling a power component of an ultrasonic source and a resonance tube arranged between the ultrasonic source and the heat sink. The cooling module is designed to guide a stream of air flowing through the resonance tube in a circumferential predefined direction (e.g., in a direction along an inner circumference of the resonance tube). The electronic device includes a power component and a heat sink provided for cooling, the heat sink of the cooling module being designed and arranged for cooling the power component.