INTERFACE BLOCK; SYSTEM FOR AND METHOD OF CUTTING A SUBSTRATE BEING TRANSPARENT WITHIN A RANGE OF WAVELENGTHS USING SUCH INTERFACE BLOCK

The present application describes a system for cutting a substrate (102) that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum and will include an edge when extracted from a sheet of substrate (102). The system generally includes a laser (104) capable of emi...

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Bibliographische Detailangaben
1. Verfasser:	Genier Michael Lucien
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present application describes a system for cutting a substrate (102) that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum and will include an edge when extracted from a sheet of substrate (102). The system generally includes a laser (104) capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate (102) is transparent; an optical device (106) positioned in the light path of the laser; and an interface block (108) composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate (102) is also transparent, wherein said interface block (108) is positioned in said light path and between the substrate (102) and said optical element (108).