A THREE-DIMENSIONAL MEMORY DEVICE

According to one embodiment, the plurality of contact vias extend in the stacking direction in the insulating layer, and are in contact with the end parts of the electrode layers. The plurality of second columnar parts extend in the stacking direction in the second stacked part, and include a plural...

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Hauptverfasser: YOSHIMIZU Yasuhito, GAWASE Akifumi, AKEBOSHI Yuya
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Sprache:eng
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creator YOSHIMIZU Yasuhito
GAWASE Akifumi
AKEBOSHI Yuya
description According to one embodiment, the plurality of contact vias extend in the stacking direction in the insulating layer, and are in contact with the end parts of the electrode layers. The plurality of second columnar parts extend in the stacking direction in the second stacked part, and include a plurality of second semiconductor bodies being different in length in the stacking direction.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title A THREE-DIMENSIONAL MEMORY DEVICE
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